| 單元 | 主題 | 課程內容 |
| 1 | 高密度機櫃散熱挑戰 | AI伺服器功耗特性、GPU發熱分析、高密度機櫃散熱挑戰 |
| 2 | 液冷架構 | 一次側、二次側、CDU與重要元件 |
| 3 | Heat pipe spreading (熱擴散設計) | Heat pipe/vapor chamber/thermosyphon/pulsating heat pipe, contact resistance (TIM) |
| 4 | 單相微通道冷板 | Cross flow, impingement flow, multiple nozzle design |
| 5 | 兩相微通道冷板 | Stability control, concentrated heat source, working fluids |
| 6 | 浸沒式冷卻 | Single-phase, two-phase, target cold plate design |